发明名称 SPIRAL-SHAPED EQUALIZER ON AN INTERPOSER SUBSTRATE, 2.5-DIMENSIONAL INTEGRATED CIRCUIT INCLUDING THE SAME AND THE MANUFACTURING THEREOF
摘要 <p>An equalizer includes a first spiral metal placed in an upper part of an insulating layer on an interposer substrate including first and second terminals; and first and second connecting parts. The first connecting part includes a first surface electrically connected to a second metal in which an electrical signal on the insulating layer flows; and a second surface electrically connected to the first terminal of the first spiral metal while facing the first surface. The second connecting part includes a third surface electrically connected to a third metal connected to an earthing voltage on the insulating layer; and a fourth surface electrically connected to the second terminal of the first spiral metal while facing the third surface.</p>
申请公布号 KR101486789(B1) 申请公布日期 2015.01.27
申请号 KR20130053587 申请日期 2013.05.13
申请人 发明人
分类号 H01L23/48;H01L23/52 主分类号 H01L23/48
代理机构 代理人
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