COPPER CLAD LAMINATE, PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING OF THE SAME

摘要

The present invention relates to a copper clad laminate capable of improving the adhesion of a via hole, a printed circuit board and a method for manufacturing of the same. A copper clad laminate according to the embodiment of the present invention includes an insulating layer which includes one side and the other side, and a first coper clad layer and a second copper clad layer which include one side which is a smooth side and the other side which is a rough side and has higher illuminance compared to the smooth side. A side of the insulating layer touches the rough side of the first copper clad layer. The other side of the insulating layer touches the smooth side of the second copper clad layer.