| 摘要 |
<p>PURPOSE: A substrate heat processing device is provided to simplify the assembling and attaching process of a suction pipe to a heat processing plate by using a connection member which has a heat-resistant property. CONSTITUTION: A cassette station(2) draws in and out a wafer from a cassette(C). A wafer carrier arm(7), which moves along a carrier path(6), is installed in the cassette station. A processing station(3) is formed by arranging several processing units in a multiple stage. The processing station comprises five processing unit groups. A first return device(110) is installed between a third processing unit group(G3) and a fourth processing unit group(G4). A second return device(120) is installed between the fourth processing unit group and a fifth processing unit group(G5).</p> |
