PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED FILM, CURED FILM, ORGANIC EL DISPLAY DEVICE, AND LIQUID CRYSTAL DISPLAY DEVICE

摘要

Provided is a photosensitive resin composition capable of achieving adhesion with a substrate when used as a cured film and during development. This photosensitive resin composition contains: (A) a polymer component containing a polymer that satisfies (1) and/or (2), (1) being a polymer having a constituent unit (a1) that has a group in which an acid group is protected by an acid-decomposable group, and a constituent unit (a2) having a crosslinking group, and (2) being a polymer having a constituent unit (a1) that has a group in which an acid group is protected by an acid-decomposable group, and a polymer having a constituent unit (a2) having a crosslinking group; (B) a nonionic photoacid generator; (C) a compound represented by the general formula (S) below (in the formula, R1 represents a group containing at least one or more nitrogen atoms, A represents a bivalent linking group, and R2 represents an organic group.); (D) a solvent; and (E) an alkoxysilane compound.