| 摘要 |
<p>Provided are a printed wiring board and an alkali-developable thermosetting resin composition with which a pattern layer can be formed by developing, even when an inorganic filler is filled in to a high level. Furthermore, the aim of the present invention is to provide a printed wiring board and an alkali-developable thermosetting resin composition with which a pattern layer exhibiting superior cooling/heating cycle characteristics can be formed. The alkali-developable thermosetting resin composition is characterized by containing an alkali-developable resin, a heat-reactive compound, an inorganic filler and a photobase-generating agent, and by using selective optical irradiation to cause an addition reaction between the alkali-developable resin and the heat-reactive compound in order to enable negative pattern formation by alkali development.</p> |
