| 摘要 |
<p>Provided is an EFEM. According to the present invention, a rapid increase in moisture concentration in a purge target container immediately after the opening of the door of the purge target container whose inner space moisture concentration is reduced by bottom purge processing is prevented and suppressed so that moisture attachment-based wafer quality deterioration can be avoided. The EFEM has a shield gas curtain device (6) capable of gas curtain formation. When the inner space (5S) of the purge target container (5) whose moisture concentration is reduced to a predetermined value by a bottom purge apparatus (25) disposed in a load port (2) communicates with an inner space (3S) of a wafer transport chamber (3), a shield curtain gas is injected directly below from a position higher than an upper edge of an opening portion (23) at a position closer to the wafer transport chamber (3) than the opening portion (23) of the load port (2) in the vicinity of the opening portion (23) so that the opening portion (23) can be sealed.</p> |
