| 摘要 |
<p>An epoxy resin curable composition suggested in the present invention comprises cycloaliphatic epoxy resin, an aromatic diamine curable agent and a strong acid salt catalyst. The epoxy resin curable composition has 500 to 1,500 cps of viscosity of a mixture at room temperature, equal to or higher than 1.8% of tensile elongation after hardening, and equal to or higher than 200°C of glass transition temperature. According to the present invention, resins can be mass-produced, which can be applied to a process for filament winding or the like because of having excellent heat resistance while having lower viscosity than an epoxy resin curable composition with the existing heat resistance.</p> |
