| 摘要 |
<p>A composition for forming a printed circuit board is provided to improve mechanical property and thermal property in use as a material of a substrate, to ensure excellent heat resistance and reduced thermal expansion. A composition for forming a printed circuit board comprises a polyamic acid of chemical formula 1 which is introduced with a cross-linkable group to at least one of both ends of a main chain; a liquid crystalline polymer or a liquid crystal thermoset oligomer; and organic solvent. In chemical formula 1, A is represented by chemical formula 2; if n is 2 or more, A is identical or different; Each Z1 and Z2 may be identical or different and is a monovalent crosslinkable functional group having a carbon-carbon double bond; Y1 is divalent aliphatic or aromatic organic group; and n is an integer of 1-1,000.</p> |
