发明名称 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERNED CURED FILM, AND ELECTRONIC COMPONENT
摘要 The invention provides a photosensitive resin composition comprising (A) an alkali-soluble resin having a phenolic hydroxyl group, (B) a compound that generates an acid by light, and (C) an acrylic resin having a group that crosslinks with the component (A), as well as a method for manufacturing a patterned cured film, and an electronic component prepared therewith.
申请公布号 US2015024173(A1) 申请公布日期 2015.01.22
申请号 US201314377323 申请日期 2013.02.04
申请人 Hitachi Chemical Co., Ltd. 发明人 Tahara Shingo;Katogi Shigeki;Matsutani Hiroshi;Abe Kouichi;Tanimoto Akitoshi;Aoki Yu
分类号 G03F7/038;G03F7/40 主分类号 G03F7/038
代理机构 代理人
主权项 1. A photosensitive resin composition comprising: (A) an alkali-soluble resin having a phenolic hydroxyl group; (B) a compound that generates an acid by light; and (C) an acrylic resin having a group that crosslinks with the component (A).
地址 Tokyo JP