发明名称 |
CONDUCTIVE-PATTERN FORMING METHOD AND COMPOSITION FOR FORMING CONDUCTIVE PATTERN BY PHOTO IRRADIATION OR MICROWAVE HEATING |
摘要 |
Provided are a conductive pattern forming method and a composition for forming a conductive pattern by photo irradiation or microwave heating, capable of increasing the conductivity of the conductive pattern. A conductive pattern is formed by preparing a composition for forming a conductive pattern comprising, copper particles each having a copper oxide thin film on the entirety or a part of the surface thereof, copper oxide particles, a reducing agent such as a polyhydric alcohol, a carboxylic acid, or a polyalkylene glycol, and a binder resin; forming a printed pattern having any selected shape on a substrate using this composition for forming a conductive pattern; and subjecting the printed pattern to photo irradiation or microwave heating to generate a sintered body of copper. |
申请公布号 |
US2015024120(A1) |
申请公布日期 |
2015.01.22 |
申请号 |
US201214359958 |
申请日期 |
2012.11.26 |
申请人 |
SHOWA DENKO K.K. |
发明人 |
Uchida Hiroshi |
分类号 |
H01B13/00;C09D11/52 |
主分类号 |
H01B13/00 |
代理机构 |
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代理人 |
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主权项 |
1. A composition for forming a conductive pattern by photo irradiation or microwave heating, comprising,
copper particles each having a copper oxide thin film on the entirety or a part of the surface thereof, copper oxide particles having a diameter smaller than that of the copper particles, a reducing agent, and a binder resin. |
地址 |
Minato-ku, Tokyo JP |