发明名称 CONDUCTIVE-PATTERN FORMING METHOD AND COMPOSITION FOR FORMING CONDUCTIVE PATTERN BY PHOTO IRRADIATION OR MICROWAVE HEATING
摘要 Provided are a conductive pattern forming method and a composition for forming a conductive pattern by photo irradiation or microwave heating, capable of increasing the conductivity of the conductive pattern. A conductive pattern is formed by preparing a composition for forming a conductive pattern comprising, copper particles each having a copper oxide thin film on the entirety or a part of the surface thereof, copper oxide particles, a reducing agent such as a polyhydric alcohol, a carboxylic acid, or a polyalkylene glycol, and a binder resin; forming a printed pattern having any selected shape on a substrate using this composition for forming a conductive pattern; and subjecting the printed pattern to photo irradiation or microwave heating to generate a sintered body of copper.
申请公布号 US2015024120(A1) 申请公布日期 2015.01.22
申请号 US201214359958 申请日期 2012.11.26
申请人 SHOWA DENKO K.K. 发明人 Uchida Hiroshi
分类号 H01B13/00;C09D11/52 主分类号 H01B13/00
代理机构 代理人
主权项 1. A composition for forming a conductive pattern by photo irradiation or microwave heating, comprising, copper particles each having a copper oxide thin film on the entirety or a part of the surface thereof, copper oxide particles having a diameter smaller than that of the copper particles, a reducing agent, and a binder resin.
地址 Minato-ku, Tokyo JP