| 摘要 |
PROBLEM TO BE SOLVED: To provide a glass substrate with a thickness of 100 μm or less, satisfying a grade required for the substrate on which a thin-film electric circuit is formed.SOLUTION: In a glass substrate having a board thickness of 10-200 μm, a board thickness difference between the maximum board thickness and the minimum board thickness in the substrate is 30 μm or less, and after being kept at 450°C for 10 hours, a thermal shrinkage when the temperature is lowered at the rate of 5°C/min is smaller than 300 ppm. |
