| 主权项 |
1. A non-destructive sugar content measuring apparatus, comprising:
a measuring sensor portion 30 for including an LED light source 32 which has LEDs 32-1, 32-2, 32-3, 32-4 and 32-5 circularly arranged, an optical sensor 40 which receives light reflected by a flesh of a fruit F, and a temperature sensor 61, in order to predict sugar content through a statistical analysis method in which the optical sensor 40 to be used as a spectral sensor receives a near infrared ray from the light which is emitted from the light source 32 and reflected by the flesh FB of the fruit F of which the sugar content is measured; a casing including a rear half body 20 on which the measuring sensor portion 30 extends outwardly and a front half body 1 combined with the rear half body 20 to constitute the casing of the sugar content measuring apparatus 100, the front half body 1 having a panel portion 10 which has a digital display 11 for displaying a brix value as a digital value and operational switches, the panel portion and the operational switches being mounted on a front face thereof; a main circuit board PB for including a Central Processing Unit (CPU) 60 which processes electric signals from the optical sensor 40 and performs a calculation and determination, an EPROM 62 which stores temperature data from the temperature sensor 61 and light source data from the LED light source 32, and a rechargeable electric power supplying portion 70, the main circuit board being embedded in the casing; and the CPU 60 enabling the digital display 11 to display the sugar content as a numeric value which is obtained by processing a light waveform, which is measured based on wavelength data corresponding to electric processing signals from the optical sensor 40, temperature data from the temperature sensor 61 and light source data from the LED light source 32, by means of a statistic analysis method, wherein the optical sensor 40 is an element on the sensor unit U which is mounted on a circuit board UB separated from the main circuit board PB, and has a spectral filter 41 and a CMOS Image Sensor (CIS) 42 in which nano-filter arrays are mass-manufactured and monolithically integrated on a CIS wafer by using a semiconductor process of an optical lithography, a sensor signal processing microcomputer SC is mounted, as a pretreatment means for processing and transmitting an electric signal from the optical sensor 40 to the CPU 60, on an identical circuit board as that for the optical sensor 40, and constitutes an independent sensor unit U, and the optical sensor 40 is disposed in the measuring sensor portion 30 and exposed outwardly. |
