| 摘要 |
<p>A microelectronic assembly (10) or package can include support elements (102, 104) and a microelectronic element (120) between facing surfaces of the support elements. Connectors (161, 162) such as solder balls (161), metal posts (181), stud bumps (221), or the like face inwardly from the respective support elements and are aligned with and electrically coupled with one another. An encapsulation (150) may separate respective pairs of coupled first and second connectors from one another, encapsulate the microelectronic element, and may fill spaces between the support elements. The first connectors, the second connectors or both may be partially encapsulated (152, 952) prior to coupling respective pairs of the connectors in columns.</p> |
