发明名称 ELECTROMAGNETIC WAVE SHIELD FILM, FLEXIBLE PRINTED WIRING BOARD WITH ELECTROMAGNETIC WAVE SHIELD FILM, ELECTRONIC EQUIPMENT, AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an electromagnetic wave shield film that facilitates manufacture of a flexible printed wiring board with an electromagnetic wave shield film in a good yield, in which good heat resistance is achieved and the electromagnetic wave shield film can be electrically connected to an outside conductor other than the flexible printed wiring board, and to provide a flexible printed wiring board provided with the electromagnetic wave shield film, electronic equipment provided with the flexible printed wiring board, and methods for manufacturing these components and equipment.SOLUTION: An electromagnetic wave shield film 10 includes: a conductive support substrate 12 comprising a cured product of a thermosetting resin containing a conductive filler; a metal thin film layer 14 covering one surface of the conductive support substrate 12; a thermosetting adhesive layer 16 covering a surface of the metal thin film layer 14; and a release film 18 covering the other surface of the conductive support substrate 12.
申请公布号 JP2015015304(A) 申请公布日期 2015.01.22
申请号 JP20130139991 申请日期 2013.07.03
申请人 SHIN ETSU POLYMER CO LTD 发明人 KAWAGUCHI TOSHIYUKI
分类号 H05K9/00 主分类号 H05K9/00
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