| 摘要 |
PROBLEM TO BE SOLVED: To provide a module structure capable of improving reliability of a product.SOLUTION: A die pad 2, a pad for a component and a wire pad 4, are provided on a substrate 1. Coating material 5 covers a corner 11 of the die pad 2 or the like. A resin 9 covers the die pad 2 or the like and the coating material 5. Adhesion of the coating material 5 with the die pad or the like, or with the resin 9, is higher than adhesion of the die pad 2 or the like with the resin 9, and a corner 10 of the coating material 5 has a radius of 0.05 to 0.25 nm. |
