| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning device capable of suppressing remaining of foreign substance even if rotational speed and flow rate of a semiconductor wafer change when cleaning the semiconductor wafer.SOLUTION: A cleaning device is arranged on a spin table that rotates a semiconductor wafer, for jetting fluid from below, and sucks the semiconductor wafer to the spin table by a Bernoulli chuck. It includes the spin table which is thin in thickness and is almost columnar, being recessed in a mortal shape from an outer periphery toward a central part, a tube which is provided at the central part of the spin table, for supplying fluid from below, a nozzle which is engaged with a tip of the tube and contains a jetting hole for jetting the fluid in a horizontal direction and upward in a vertical direction, and a retainer for changing the flow direction of the fluid jetted in the horizontal direction from a side surface of the nozzle. A flange protruding outways is provided on the upper surface of the nozzle. |
