FPC BOARD AND CONNECTION METHOD THEREOF, AND PACKAGE FOR HOUSING ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide: an FPC board capable of preventing deterioration in reflection characteristics due to an increase of mismatching of characteristic impedance of high frequency signals at a contact part between a dielectric board and a tip of the FPC board; a connection method of the FPC board; and a package for housing an electronic component.SOLUTION: An FPC board 10 includes a wiring conductor 12 for a signal line and a wiring conductor 13 for a ground line in a surface longitudinal direction of a long base film 11 made of a flexible resin, and also includes an insulator part 15 where a surface of the base film 11 is exposed to the outside, between at least a tip of the wiring conductor 12 for a signal line and a tip face 14 of the base film 11.