| 发明名称 |
LIQUID COATING COMPOSITION AND A COATING METHOD USING THE SAME |
| 摘要 |
A liquid coating composition to protect electronic elements on a circuit board includes a heat curable resin composition, a photocurable resin, a photoinitiator, a curing agent, and a solvent. The heat curable resin composition includes poly(acrylic acid) oligomer and at least one compound selected from the group consisting of an epoxy resin and polyester polyol. The curing agent includes at least one compound selected from the group consisting of dicarboxylic anhydride and isocyanate. A method for applying and solidifying the liquid coating composition to form a cured film on a substrate and a resulting composite structure are also provided. |
| 申请公布号 |
US2015024213(A1) |
申请公布日期 |
2015.01.22 |
| 申请号 |
US201414328896 |
申请日期 |
2014.07.11 |
| 申请人 |
FIH (Hong Kong) Limited |
发明人 |
CHIANG CHWAN-HWA;WANG CHIEH-HSIANG |
| 分类号 |
C09D133/02;B05D3/06;C09D163/00 |
主分类号 |
C09D133/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A liquid coating composition, comprising:
a heat curable resin composition comprising poly (acrylic acid) oligomer and at least one compound selected from the group consisting of an epoxy resin and polyester polyol; a photocurable resin; a photoinitiator; a curing agent comprising at least one compound selected from the group consisting of dicarboxylic anhydride and isocyanate; and a solvent. |
| 地址 |
Kowloon HK |
