SPUTTERING APPARATUS AND METHOD

摘要

A deposition apparatus for depositing a layer of deposition material on a substrate is provided. The apparatus includes a substrate support adapted for holding the substrate; a target support (520) adapted for holding a target assembly. The target assembly includes a backing element and at least two target elements (510, 511) arranged on the backing element next to each other so that a gap (530) is formed between the at least two target elements. The gap between the target elements is to have a width (w). Further, the substrate support and the target support are arranged with respect to each other so that the ratio of distance between substrate and target (570) element to the gap width (w) is about 150 and greater.

主权项

1. Deposition apparatus for depositing a layer of deposition material on a substrate, the apparatus comprising:
a substrate support adapted for holding the substrate; a target support adapted for holding a target assembly, the target assembly comprising a backing element; and at least two target elements arranged on the backing element next to each other so that a gap is formed between the at least two target elements, the gap being adapted to have a width w, wherein the substrate support and the target support are arranged with respect to each other so that the ratio of distance between the substrate and the target element to the gap width w is at least about 150.