| 发明名称 |
SURFACE-MOUNTING SUBSTRATE |
| 摘要 |
A surface mounting substrate for surface mounting an electronic part using a lead-free solder includes a joint portion of the substrate to which the electronic parts is joined; and a stress relaxation portion formed in a vicinity of the joint portion of the substrate. |
| 申请公布号 |
US2015021075(A1) |
申请公布日期 |
2015.01.22 |
| 申请号 |
US201414505074 |
申请日期 |
2014.10.02 |
| 申请人 |
FUJI ELECTRIC FA COMPONENTS & SYSTEMS CO., LTD. |
发明人 |
OKAMOTO Kokichi;TAGUCHI Takahiro |
| 分类号 |
H05K1/02;H05K1/11;H05K3/34;H05K1/18 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A surface mounting substrate for surface-mounting an electronic part using a lead-free solder, comprising:
a joint portion of the substrate to which the electronic part is adapted to be joined; and a stress relaxation portion formed in a vicinity of the joint portion. |
| 地址 |
Tokyo JP |
