SUBSTRATE CLEANING DEVICE, SUBSTRATE CLEANING APPARATUS, CLEANED SUBSTRATE MANUFACTURING METHOD AND SUBSTRATE PROCESSING APPARATUS

摘要

A substrate cleaning device 1 includes a substrate holding unit 10 configured to hold a substrate W, a first cleaning unit 11 having a first cleaning member 11a caused to come into contact with a first surface WA of the substrate W held by the substrate holding unit 10 to clean the first surface WA, a second cleaning unit 12 having a second cleaning member 12a caused to come into contact with the first surface WA of the substrate W held by the substrate holding unit 10 to clean the first surface WA, and a controller 50 configured to control the first and second cleaning units 11, 12 so that, when any one of the first cleaning member 11a and the second cleaning member 12a cleans the first surface WA of the substrate W held by the substrate holding unit 10, the other cleaning member is at a position apart from the substrate W held by the substrate holding unit 10.

主权项

1. A substrate cleaning device comprising:
a substrate holding unit configured to hold a substrate, the substrate having a first surface and a second surface, the second surface opposite to the first surface; a first cleaning unit having a first cleaning member, the first cleaning member caused to come into contact with the first surface of the substrate held by the substrate holding unit to clean the first surface; a second cleaning unit having a second cleaning member, the second cleaning member caused to come into contact with the first surface of the substrate held by the substrate holding unit to clean the first surface; and a controller configured to control the first cleaning unit and the second cleaning unit so that, when any one of the first cleaning member and the second cleaning member cleans the first surface of the substrate held by the substrate holding unit, the other cleaning member is at a position apart from the substrate held by the substrate holding unit.