| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-piece substrate and a wiring board manufacturing method, which can prevent displacement of a cut position when wiring boards are cut from the multi-piece substrate.SOLUTION: A multi-piece substrate 41 comprises: a number of BGA pads 7 arranged in a matrix in a plane on a second principal surface side; and square alignment marks 15 which are formed on four corners of the arrangement of the BGA pads 7 instead of circle BGA pads 7. Accordingly, when a picture of the second principal surface side of the multi-piece substrate 41 is taken to perform image recognition of the BGA pads 7 and the alignment marks 15, because shapes of the BGA pad 7 and the alignment mark 15 are different, the BGA pad 7 and the alignment mark 15 can be easily discriminated. As a result, since positions of the alignment marks 15 are easily recognized, cut positions for cutting out the wiring boards 1 can be definitely grasped based on the positions of the alignment marks 15 when wiring boards 1 are cut out from the multi-piece substrate 41. |
