SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can distinguish an encapsulation body and a semiconductor device from one another in a manufacturing process of the semiconductor device.SOLUTION: A semiconductor device manufacturing method comprises: a process A of flip-chip bonding a semiconductor chip to a circuit formation surface of a semiconductor wafer; a process B of embedding the semiconductor chip flip-chip bonded to the semiconductor wafer to form an encapsulation body; a process C of grinding the encapsulation sheet of the encapsulation body to show a rear face of the semiconductor chip; and a process D of dicing the encapsulation body in which the rear face of the semiconductor chip is shown. The semiconductor device manufacturing method comprises a process of performing laser marking on the encapsulation sheet between the process B and the process C and/or between the process C and the process D.