发明名称 LOW-PROFILE SURFACE-MOUNT ELECTROMAGNETIC COMPONENT ASSEMBLY AND METHODS OF MANUFACTURE
摘要 <p>PROBLEM TO BE SOLVED: To provide a miniaturized surface-mount power inductor component that allows the component to capably handle higher current and higher power.SOLUTION: A low-profile surface mount electromagnetic component 100, such as a power inductor, includes first and second core pieces 104 and 106 arranged side by side and having longitudinal side walls 130 and 132 facing one another. A coil winding 108 includes vertical legs that are received in vertical slots of the facing longitudinal sidewalls of a component. Inset depressed surfaces are provided in the top surfaces 122 of the first and second core pieces and receive a main winding section 154 of the coil winding. A surface mount terminal tab 158 extends on the bottom surfaces 124 of both the first and second core pieces.</p>
申请公布号 JP2015015470(A) 申请公布日期 2015.01.22
申请号 JP20140137076 申请日期 2014.07.02
申请人 COOPER TECHNOLOGIES CO 发明人 ZHOU DENGYAN;YAN YIPENG;ROBERT JAMES BOGERT;BRENT ELLIOTT
分类号 H01F37/00;H01F17/04;H01F27/24;H01F27/29;H01F41/04;H01F41/10 主分类号 H01F37/00
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