发明名称 |
LOW-PROFILE SURFACE-MOUNT ELECTROMAGNETIC COMPONENT ASSEMBLY AND METHODS OF MANUFACTURE |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a miniaturized surface-mount power inductor component that allows the component to capably handle higher current and higher power.SOLUTION: A low-profile surface mount electromagnetic component 100, such as a power inductor, includes first and second core pieces 104 and 106 arranged side by side and having longitudinal side walls 130 and 132 facing one another. A coil winding 108 includes vertical legs that are received in vertical slots of the facing longitudinal sidewalls of a component. Inset depressed surfaces are provided in the top surfaces 122 of the first and second core pieces and receive a main winding section 154 of the coil winding. A surface mount terminal tab 158 extends on the bottom surfaces 124 of both the first and second core pieces.</p> |
申请公布号 |
JP2015015470(A) |
申请公布日期 |
2015.01.22 |
申请号 |
JP20140137076 |
申请日期 |
2014.07.02 |
申请人 |
COOPER TECHNOLOGIES CO |
发明人 |
ZHOU DENGYAN;YAN YIPENG;ROBERT JAMES BOGERT;BRENT ELLIOTT |
分类号 |
H01F37/00;H01F17/04;H01F27/24;H01F27/29;H01F41/04;H01F41/10 |
主分类号 |
H01F37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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