发明名称 LASER MACHINING METHOD, LASER MACHINING APPARATUS, AND LASER MACHINING PROGRAM
摘要 Variation in hole diameter due to heating effects is minimized even if the shortest machining route is set, and machining quality is improved. A printed circuit board to be scanned by a laser beam is divided into a plurality of scan areas (S1). An order of drilling within the scan area is sorted to obtain a scanning route with the shortest distance (S2). The order of the (N+1)th hole and the (N+2)th hole is swapped in each scanning area if it is determined that the distance between the Nth hole and the (N+1)th hole (here, N is an integer in a range of 1≦N≦“the maximum number of holes to be drilled in the area”−1″) is less than a predetermined threshold value, and that N+1 is not correspond to the maximum number of holes to be drilled in the scanning area (S3). The scanning area is machined and then machining each scanning area, specifically in machining the (N+1)th hole, after pausing for a period of a predetermined heat dissipation time if it is determined that the distance between the N-th hole and the (N+1)th hole swapped is less than the predetermined threshold value. Subsequently, machining is performed (S4).
申请公布号 US2015021304(A1) 申请公布日期 2015.01.22
申请号 US201313945509 申请日期 2013.07.18
申请人 Hitachi Via Mechanics, Ltd. 发明人 OZAWA Hidekatsu
分类号 G06Q10/04;B23K26/38;H05K3/00 主分类号 G06Q10/04
代理机构 代理人
主权项 1. A laser machining method for performing a plurality of drill machining on a printed circuit board with a laser beam, comprising: providing a scanning means for scanning the laser beam onto a surface of the printed circuit board in an X direction and a Y direction, the laser beam being emitted from a laser beam source; providing an XY table for moving the printed circuit board in the X direction and the Y direction; dividing the printed circuit board to be scanned by the laser beam into a plurality of scan areas; sorting an order of drilling within each scan area to obtain a scanning route with a shortest distance; swapping the order of the (N+1)th hole and the (N+2)th hole, in each scanning area, if it is determined that the distance between the N-th hole and the (N+1)th hole (here, N is an integer in a range of “1≦N≦“the maximum number of holes to be drilled in the area”−1) is less than a predetermined threshold value, and that the (N+1)th hole does not correspond to the maximum number of the holes to be drilled in the scanning area; and machining each scanning area, specifically in machining the N-th hole and then machining the (N+1)th hole after pausing for a period of a predetermined heat dissipation time if it is determined that the distance between the N-th hole and the (N+1)th hole swapped is less than the predetermined threshold value.
地址 Ebina-shi JP