| 发明名称 |
METHOD AND SYSTEM FOR THINNING WAFER THEREOF |
| 摘要 |
Embodiments of a method for thinning a wafer are provided. The method includes placing a wafer on a support assembly and securing an etching mask to a backside of the wafer. The etching mask covers a peripheral portion of the wafer. The method further includes performing a wet etching process on the backside of the wafer to form a thinned wafer, and the thinned wafer includes peripheral portions having a first thickness and a central portion having a second thickness smaller than the first thickness. Embodiments of system for forming the thinned wafer are also provided. |
| 申请公布号 |
US2015024606(A1) |
申请公布日期 |
2015.01.22 |
| 申请号 |
US201313944257 |
申请日期 |
2013.07.17 |
| 申请人 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
发明人 |
HWANG Chien-Ling;JANG Bor-Ping;LIAO Hsin-Hung;LIU Chung-Shi |
| 分类号 |
H01L21/306;H01L21/308 |
主分类号 |
H01L21/306 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for thinning a wafer, comprising:
placing a wafer on a support assembly; securing an etching mask to a backside of the wafer, wherein the etching mask covers a peripheral portion of the wafer; and performing a wet etching process on the backside of the wafer to form a thinned wafer, wherein the thinned wafer comprises peripheral portions having a first thickness and a central portion having a second thickness smaller than the first thickness. |
| 地址 |
Hsin-Chu TW |
