发明名称 |
HOUSING FOR ELECTRONIC COMPONENTS |
摘要 |
The invention relates to a housing for electronic components with the housing comprising at least a front housing part and a rear housing part. The front housing part and the rear housing part are arranged to be sealed by means of a sealing gasket upon attaching the front housing part to the rear housing part. The housing comprises at least one ventilation opening to prevent build-up of negative pressure inside the housing, where the ventilation opening is covered by a protective covering comprising a through opening. The through opening is arranged to allow water to flow through the through opening, thereby preventing a build up of pressure inside the protective covering. A method for manufacturing a housing according to the invention is also disclosed. |
申请公布号 |
US2015021066(A1) |
申请公布日期 |
2015.01.22 |
申请号 |
US201214380723 |
申请日期 |
2012.02.28 |
申请人 |
Hillstrom Per;Fardig Mikael;Fredriksson Daniel;Olsson Sofia |
发明人 |
Hillstrom Per;Fardig Mikael;Fredriksson Daniel;Olsson Sofia |
分类号 |
H05K5/02;H05K5/06;H05K9/00;B32B38/00 |
主分类号 |
H05K5/02 |
代理机构 |
|
代理人 |
|
主权项 |
1. A housing for electronic components, the housing comprising at least a front housing part and a rear housing part, the front housing part and the rear housing part being arranged to be sealed by means of a sealing gasket upon attaching the front housing part to the rear housing part; the housing comprising at least one ventilation opening to prevent build-up of negative pressure inside the housing, wherein the ventilation opening is covered by a protective covering comprising a through opening, where the through opening is arranged to allow water to flow through the through opening, thereby preventing a build up of pressure inside the protective covering. |
地址 |
Molnlycke SE |