发明名称 Method for Manufacturing Laminated Coil Devices
摘要 A method of manufacturing a laminated coil device includes conductors for forming coils and insulation stacking for forming laminated bodies, and further includes the steps of: (A) manufacturing ceramic insulating thin sheets; (B) forming ceramic insulating thin sheets with conductive through-holes; (C) manufacturing coil thin sheets with coil conductors so as to embed the coil conductors inside the ceramic insulating thin sheets; (D) orderly stacking and cutting ceramic insulating thin sheets and coil thin sheets with coil conductors into unit sizes in order to obtain laminated bodies; (E) heating the laminated bodies in order to remove the binder, and then sintering the laminated bodies; (F) coating the conductive paste on the two ends of the laminated bodies so as to fen external electrodes. Thus, the present invention is to provide a manufacturing method of producing a laminated coil power device with low direct current resistance, no delamination, no air space, and no lamination cracking.
申请公布号 US2015020378(A1) 申请公布日期 2015.01.22
申请号 US201213978542 申请日期 2012.03.23
申请人 Shenzhen Sunlord Electronics Co., Ltd. 发明人 Li Youyun;Lu Dafu;Zhang Yang;Yuan Cong
分类号 H01F41/04 主分类号 H01F41/04
代理机构 代理人
主权项 1. A method of manufacturing a laminated coil device comprising the steps of: (A) manufacturing ceramic insulating thin sheets; (B) forming parts of ceramic insulating thin sheets to have conductive through-holes; (C) manufacturing coil thin sheets having coil conductors so as to embed coil conductors inside said ceramic insulating thin sheets; and (D) orderly stacking and cutting said ceramic insulating thin sheets and said coil thin sheets having coil conductors into unit sizes in order to obtain laminated bodies.
地址 Shenzhen CN