发明名称 |
Method for Manufacturing Laminated Coil Devices |
摘要 |
A method of manufacturing a laminated coil device includes conductors for forming coils and insulation stacking for forming laminated bodies, and further includes the steps of: (A) manufacturing ceramic insulating thin sheets; (B) forming ceramic insulating thin sheets with conductive through-holes; (C) manufacturing coil thin sheets with coil conductors so as to embed the coil conductors inside the ceramic insulating thin sheets; (D) orderly stacking and cutting ceramic insulating thin sheets and coil thin sheets with coil conductors into unit sizes in order to obtain laminated bodies; (E) heating the laminated bodies in order to remove the binder, and then sintering the laminated bodies; (F) coating the conductive paste on the two ends of the laminated bodies so as to fen external electrodes. Thus, the present invention is to provide a manufacturing method of producing a laminated coil power device with low direct current resistance, no delamination, no air space, and no lamination cracking. |
申请公布号 |
US2015020378(A1) |
申请公布日期 |
2015.01.22 |
申请号 |
US201213978542 |
申请日期 |
2012.03.23 |
申请人 |
Shenzhen Sunlord Electronics Co., Ltd. |
发明人 |
Li Youyun;Lu Dafu;Zhang Yang;Yuan Cong |
分类号 |
H01F41/04 |
主分类号 |
H01F41/04 |
代理机构 |
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代理人 |
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主权项 |
1. A method of manufacturing a laminated coil device comprising the steps of:
(A) manufacturing ceramic insulating thin sheets; (B) forming parts of ceramic insulating thin sheets to have conductive through-holes; (C) manufacturing coil thin sheets having coil conductors so as to embed coil conductors inside said ceramic insulating thin sheets; and (D) orderly stacking and cutting said ceramic insulating thin sheets and said coil thin sheets having coil conductors into unit sizes in order to obtain laminated bodies. |
地址 |
Shenzhen CN |