WIRING BOARD AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a wiring board having a pad formed in such a shape that the connection reliability with an object can be improved, and to provide a method of manufacturing the same, and a semiconductor package.SOLUTION: A wiring board 10 has: an outermost insulating layer 12; a pad formation part 12u provided at an external exposure surface 12a side of the insulating layer 12; and a pad 11 projected from the external exposure surface 12a. The pad formation part 12u has: a recessed part 12s recessed deeper than the external exposure surface 12a; and a dam part 12t provided so as to surround the recessed part 12s in a plan view, and projected from the external exposure surface 12a. The pad 11 has: a pad main body 11a formed in the recessed part 12s and the dam part 12t, and whose one end part is projected from the dam part 12t; and an eaves part 11b laterally protruded from one end part of the pad main body 11a, and formed on the dam part 12t. One end part of the pad main body 11a has a flat surface.