| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming layer wiring, which allows for fine conductive pattern formation, multilayer wiring, and fine wiring connection, while making use of a merit of the less number of steps by printing.SOLUTION: A method for forming layer wiring comprises the steps of, on a substrate 11: forming a first wettability change layer 12; forming a first conductive layer 13; and forming a second wettability change layer 14. The method also comprises the steps of: forming a concave part 16 as a wiring pattern of a second conductive layer on the second wettability change layer 14 by a laser ablation method and changing the surface energy of the surface exposed by the formation of the concave part 16 to form a high surface energy area 14a, and then forming a via hole 18 to expose a part of the first conductive layer 13 and changing the surface energy on the surface exposed by the formation of the via hole 18 to form the high surface energy area 14a; and applying a conductive ink 19 onto the high surface energy area 14a and forming the second conductive layer 21 and a via 22 simultaneously. |
