发明名称 LED Array Member and Thermally Decoupled Integrated Control Module Assembly
摘要 A LAM/ICM assembly comprises an integrated control module (ICM) and an LED array member (LAM). In a first aspect, active circuitry is embedded in the ICM. The circuitry monitors LED operation, controls and supplies power to the LEDs, and communicates information into and out of the assembly. A thermal insulator is disposed between the ICM and a heat sink outside the lateral boundary of the LAM. In a second aspect, a lighting system comprises an AC-to-DC converter and a LAM/ICM assembly. The AC-to-DC converter outputs a substantially constant current or voltage. The magnitude of the current or voltage is adjusted by a signal output from the LAM/ICM. In a third aspect, the ICM includes a built-in switching DC-to-DC converter. An AC-to-DC power supply supplies a roughly regulated supply voltage. The switching converter within the LAM/ICM receives the roughly regulated voltage and supplies a regulated LED drive current to its LEDs.
申请公布号 US2015022088(A1) 申请公布日期 2015.01.22
申请号 US201414168452 申请日期 2014.01.30
申请人 Bridgelux, Inc. 发明人 Gershowitz Michael Neal;West R. Scott;Imangholi Babak
分类号 F21K99/00;F21V23/02;F21V29/00 主分类号 F21K99/00
代理机构 代理人
主权项 1. An assembly comprising: an LED (Light Emitting Diode) array member (LAM) comprising a plurality of LED dice disposed on a substrate member; an integrated control module (ICM) through which power is supplied to the LAM, wherein the ICM defines a central opening, wherein the LAM fits up into the central opening in the ICM and is attached to the ICM, and wherein an electrical contact is made between an upper surface of the LAM and a bottom surface of the ICM adjacent to the central opening; and a heat sink thermally coupled through a thermal interface material to a bottom surface of the substrate member of the LAM, wherein the heat sink is not thermally coupled through the thermal interface material to the ICM.
地址 Livermore CA US