| 摘要 |
<p>The present invention relates to a manufacturing method and a manufacturing device of a thermocompression bonding pad. The manufacturing device comprises a paper supplying part in which paper is unwound; a resin supplying part in which resin films are unwound; a resin cutting part which cuts the resin film shorter than the paper and is allowed to place the resin film on the paper; a support roller part which supports the resin film seated between the paper; a release film supplying part which places the release film on the resin film with unwound release film passing the support roller part; a connection part which connects the paper and resin film to the release film; and a pad cutting part which cuts the paper, resin film and the release film passing the connection part, thereby preventing the connection of thermocompression pads caused by heat and improving workability of manufacturing printed circuit board.</p> |
