发明名称 DIGITAL ENVELOPE MODULATOR FOR HAPTIC FEEDBACK DEVICES
摘要 <p>A haptic feedback device includes a signal generation module configured to output a composite signal representable by a carrier signal and an envelope signal. The signal generation module includes a microcontroller capable of being programmed such that the carrier signal falls within a resonance frequency band of the haptic feedback device. The haptic feedback device also includes a user interface device, and a transducer configured to impart haptic force to the user interface device in response to the composite signal. A tactile mapping submodule, a duration mapping submodule, and an attack/decay mapping submodule may also be included. The tactile mapping submodule enables compensation for haptic output at different positions on the haptic feedback device, whereas the duration and attack/decay submodules enable prevention of unwanted audio output.</p>
申请公布号 KR101484806(B1) 申请公布日期 2015.01.22
申请号 KR20107010614 申请日期 2008.10.03
申请人 发明人
分类号 G06F3/01;G09G5/00 主分类号 G06F3/01
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