| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which prevents breakage at the time of assembly of a large sized and thin semiconductor element which causes a large amount of heat generation as a semiconductor device for performing power conversion and which has a tab structure capable of improving bonding reliability.SOLUTION: A semiconductor device comprises a metal substrate 3 and a semiconductor element 1 arranged on the metal substrate 3. By forming convexoconcave on the metal substrate 3 in a manner such that a thickness of a bonding material 2 at a bonded part of the metal substrate 3 and the semiconductor element 1 increases with distance from the center toward a periphery of the semiconductor element 1, a heat stress can be reduced and good heat transfer can be achieved. |
