发明名称 METHOD OF PRODUCING WOODY BOARD AND WOODY BOARD
摘要 <p>PROBLEM TO BE SOLVED: To provide a method of producing a woody board 1 which takes the global environment into consideration and achieves both excellent strength properties and reduction of the formation time and a woody board 1 which is suppressed in occurrence of mold and has water resistance.SOLUTION: A method of producing a woody board 1 comprises arranging, at least on the surface of a core layer 2 adhered with a plant chip, a surface layer 3 adhered with another plant chip finer than the plant chip of the core layer 2 or a plant fiber and adhering the surface layer with an adhesive. A petroleum-originated adhesive is used as the adhesive for adhering the plant chip of the core layer 2, and a plant-originated adhesive is used as the adhesive for adhering the plant chip or the fiber of the surface layer 3.</p>
申请公布号 JP2015013442(A) 申请公布日期 2015.01.22
申请号 JP20130142100 申请日期 2013.07.05
申请人 PANASONIC IP MANAGEMENT CORP 发明人 MAEDA NAOHIKO;SUGAWARA AKIRA;ASADA TEPPEI;MORI KENJI
分类号 B27N3/00;B27K5/00;C09J103/00;C09J161/24;C09J161/28;C09J193/00;C09J195/00 主分类号 B27N3/00
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