发明名称 |
METHOD OF PRODUCING WOODY BOARD AND WOODY BOARD |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of producing a woody board 1 which takes the global environment into consideration and achieves both excellent strength properties and reduction of the formation time and a woody board 1 which is suppressed in occurrence of mold and has water resistance.SOLUTION: A method of producing a woody board 1 comprises arranging, at least on the surface of a core layer 2 adhered with a plant chip, a surface layer 3 adhered with another plant chip finer than the plant chip of the core layer 2 or a plant fiber and adhering the surface layer with an adhesive. A petroleum-originated adhesive is used as the adhesive for adhering the plant chip of the core layer 2, and a plant-originated adhesive is used as the adhesive for adhering the plant chip or the fiber of the surface layer 3.</p> |
申请公布号 |
JP2015013442(A) |
申请公布日期 |
2015.01.22 |
申请号 |
JP20130142100 |
申请日期 |
2013.07.05 |
申请人 |
PANASONIC IP MANAGEMENT CORP |
发明人 |
MAEDA NAOHIKO;SUGAWARA AKIRA;ASADA TEPPEI;MORI KENJI |
分类号 |
B27N3/00;B27K5/00;C09J103/00;C09J161/24;C09J161/28;C09J193/00;C09J195/00 |
主分类号 |
B27N3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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