| 发明名称 |
Surface Mountable Microphone Package, a Microphone Arrangement, a Mobile Phone and a Method for Recording Microphone Signals |
| 摘要 |
A surface mountable microphone package comprises a first microphone and a second microphone. Furthermore, the surface mountable microphone package comprises a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package. |
| 申请公布号 |
US2015023523(A1) |
申请公布日期 |
2015.01.22 |
| 申请号 |
US201314065067 |
申请日期 |
2013.10.28 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Elian Klaus;Theuss Horst;Mueller Thomas |
| 分类号 |
H04R1/08;B81B7/00 |
主分类号 |
H04R1/08 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A surface mountable microphone package comprising:
a first microphone; a second microphone; a first opening for the first microphone; and a second opening for the second microphone; wherein the first opening and the second opening are arranged on opposite sides of the surface mountable microphone package. |
| 地址 |
Neubiberg DE |
