DEVICE FOR CUTTING METAL PLATE

摘要

A device to cut a metal plate may include: a supporting unit having an upper surface where a metal plate is positioned; a frame unit supported by the upper surface of the supporting unit; and a cutting unit configured to move along the frame unit provided with a saw blade unit which cuts the metal plate by being rotated such that a rotary shaft can be positioned over the metal plate, wherein the saw blade unit may include a round saw blade having a plurality of sawteeth and a pad attached to the round saw blade, wherein the pad may include an anti-vibration pad configured to suppress the vibration of the round saw blade, a first magnet having a ring shape attached to a planar surface of the round saw blade of the anti-vibration pad, and a second magnet having a ring shape configured to apply clamping force to the anti-vibration pad by generating repulsion with respect to the first magnet.