发明名称 |
LOW TEMPERATURE SINTERED SILVER NANOPARTICLE COMPOSITION AND ELECTRONIC ARTICLE FORMED USING THE COMPOSITION |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a silver nanoparticle composition which is superior to adhesion to a substrate and can form a metal membrane or an electrical conduction circuit at a low temperature and in a short time.SOLUTION: A silver nanoparticle composition that a secondary aggregation diameter (median diameter) measured with a disk centrifuging-type particle size distribution measurement is not more than 2.0μm, a primary particle size metered with a transmission electron microscope is not more than 30 nm, main constituent of solvent is water, nitric acid component is 0.2-8.0 mass%, is a metal nanoparticle composition, and an electric conductivity is not less than 1 S/m.</p> |
申请公布号 |
JP2015014050(A) |
申请公布日期 |
2015.01.22 |
申请号 |
JP20140163223 |
申请日期 |
2014.08.08 |
申请人 |
DOWA ELECTRONICS MATERIALS CO LTD |
发明人 |
JABLONSKI GREGORY A;MASTROPIETRO MICHAEL A;SATO KIMITAKA;KURITA TORU;FUJITA HIDEFUMI |
分类号 |
B22F9/24;B22F1/00;B22F1/02;H01B1/00;H01B1/22;H01B5/14;H01B13/00;H05K1/09 |
主分类号 |
B22F9/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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