BAFFLE AND APPARATUS FOR TREATING SURFACE OF BAFFLE, AND SUBSTRATE TREATING APPARATUS

摘要

The present invention relates to a substrate treating apparatus, and more particularly, to an apparatus treating a substrate using plasma. In an embodiment, a baffle is formed with holes distributing a process gas excited to a plasma state, and has a surface which is treated with a surface treating material comprising a silicon compound.

主权项

1. A baffle which is formed with holes designed for distributing a process gas excited to a plasma state, the baffle having a surface which is treated with a surface treating material comprising a silicon compound.