发明名称 |
METHOD AND SYSTEM FOR AN IMMERSION BOILING HEAT SINK |
摘要 |
A method and system for cooling a heat-generating component are provided. The system includes a heat generating electronic component including a heat conductive face, a heat sink device including at least one open face pin fin array surface directly coupled to the conductive face, each fin including a distal end including an outwardly facing contact area, the contact areas covering only a portion of the conductive face, the contact areas configured to carry electrical current therethrough, and an immersion of dielectric fluid contained in a vessel, the vessel including a heat-conductive hull at least partially submerged in a heat sink fluid. |
申请公布号 |
WO2015010039(A1) |
申请公布日期 |
2015.01.22 |
申请号 |
WO2014US47225 |
申请日期 |
2014.07.18 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
BROWNE, ERIC, AYRES;GUNTURI, SATISH, SIVARAMA;RUSH, BRIAN, MAGANN;LAI, RIXIN;SUBRAMANYAM, ANURAG, KASYAP VEJJUPALLE |
分类号 |
H01L23/427;H01L25/11;H05K7/20 |
主分类号 |
H01L23/427 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|