| 发明名称 |
ELECTROLESS COPPER PLATING SOLUTION |
| 摘要 |
Provided is an electroless copper plating solution that forms a highly adhesive conductive film regardless of the degree of roughness of the resin surface and also has a fast deposition rate. The electroless copper plating solution of the present invention is characterized in that it contains guanosine. The electroless copper plating solution of the present invention preferably also contains copper ion, reducing agent, copper ion complexing agent, and pH adjuster. |
| 申请公布号 |
US2015024139(A1) |
申请公布日期 |
2015.01.22 |
| 申请号 |
US201414334714 |
申请日期 |
2014.07.18 |
| 申请人 |
Rohm and Haas Electronic Materials LLC |
发明人 |
YOSHIDA Katsuhiro;HAKIRI Yoshiyuki;KONDO Makato |
| 分类号 |
C23C18/40;C23C18/16 |
主分类号 |
C23C18/40 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electroless copper plating solution containing guanosine. |
| 地址 |
Marlborough MA US |
