| 摘要 |
This disclosure relates generally to an electronic device and method having can include a method of making a chip package. An insulator layer comprising an insulator material, the insulator layer positioned with respect to a first conductive line, forming a second conductive line with respect to the insulator layer, wherein the insulator layer is positioned between the first conductive line and the second conductive line, forming a opening in the insulator layer between the first conductive line and the second conductive line, at least some of the insulator material within the opening being exposed, and chemically bonding a conductor to the at least some of the insulator material within the opening, wherein the conductor electrically couples the first conductive line to the second conductive line. |
