| 发明名称 |
MAPPING DENSITY AND TEMPERATURE OF A CHIP, IN SITU |
| 摘要 |
A method and system to map density and temperature of a chip, in situ, is disclosed. The method includes measuring a propagation time that a mechanical propagation wave travels along at least one predefined path in a substrate. The method further includes calculating an average substrate density and temperature along the at least one predefined path as a function of the propagation time and distance. The method further includes determining a defect or unauthorized modification in the substrate based on the average substrate density being different than a baseline substrate density. |
| 申请公布号 |
US2015021605(A1) |
申请公布日期 |
2015.01.22 |
| 申请号 |
US201414510309 |
申请日期 |
2014.10.09 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CANN Jerome L.;VALLETT David P. |
| 分类号 |
G01N29/04;G01N33/00 |
主分类号 |
G01N29/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip comprising:
at least one transmitter and at least one receiver, the at least one transmitter generating a mechanical wave which is received by the at least one receiver; and a timing circuit in communication with the at least one transmitter and the at least one receiver, which measures a time in which the mechanical wave travels between the at least one transmitter and the at least one receiver. |
| 地址 |
Armonk NY US |
