PLASMA PROCESSING APPARATUS, AND PLASMA DISTRIBUTION CONTROL METHOD

摘要

PROBLEM TO BE SOLVED: To provide an inductively-coupled plasma processing apparatus which enables the suppression of sputter erosion of a metal window owing to plasma, and the control of strength distribution of the plasma.SOLUTION: A plasma processing apparatus 100 for processing a substrate G by plasma comprises: a high-frequency antenna 11 for generating inductively coupled plasma in a plasma-generating region; and a metal window 3 disposed between the plasma-generating region and the high-frequency antenna 11, and isolated from a main body container. The metal window 3 has metal windows 30a-30d isolated from each other by an insulator; each of the metal windows 30a-30d is connected to the ground at a ground point.