发明名称 LIQUID CURABLE EPOXY RESIN COMPOSITION AND ADHESIVE INCLUDING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a curable epoxy resin composition excellent in storage stability, curing characteristics, and characteristics of a cured product, especially excellent in organic solvent resistance, and an adhesive composed of the composition.SOLUTION: A liquid curable epoxy resin composition contains (A) epoxy resin or epoxy-polyester hybrid resin and (B) a curing agent and/or a curing accelerator which is an inclusion complex containing (b1) a carboxylic acid compound represented by the formula: A(COOH), and (b2) a compound represented by the formula (II) .</p>
申请公布号 JP2015013992(A) 申请公布日期 2015.01.22
申请号 JP20140157387 申请日期 2014.08.01
申请人 NIPPON SODA CO LTD 发明人 KAMEGAYA NAOYUKI;ONO KAZUO;AMAIKE MASATO;NOMURA TOMOYA
分类号 C08G59/40;C09J11/06;C09J163/00;C09J167/00 主分类号 C08G59/40
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