发明名称 |
DIE BONDER AND DIE BONDING METHOD |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a die bonder and a die bonding method having a short tact time and a high alignment accuracy by reducing the impact of vibration generated by conveyance operation or airflow produced by a heat source on an image captured for the purpose of positioning a work or a wafer.SOLUTION: Immediately after stopping the movement of a work or a die, an image pick-up device captures the image of the work or die in a shutter speed sufficiently longer than the fluctuation period (1 wavelength) of the waveform of a vibration before reaching a setting position and sufficiently longer than the wavelength of optical fluctuation due to airflow. An image processing section corrects the position by performing image processing where a blurred image thus captured is used for pattern matching.</p> |
申请公布号 |
JP2015015506(A) |
申请公布日期 |
2015.01.22 |
申请号 |
JP20140217072 |
申请日期 |
2014.10.24 |
申请人 |
HITACHI HIGH-TECH INSTRUMENTS CO LTD |
发明人 |
KOBASHI HIDEHARU;HORIUCHI AYAJI |
分类号 |
H01L21/52 |
主分类号 |
H01L21/52 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|