ELECTRONIC DEVICE COMPRISING AN INTEGRATED CIRCUIT CHIP PROVIDED WITH PROJECTING ELECTRICAL CONNECTION PADS

摘要

An electronic device includes an integrated circuit chip with an insulating passivation layer. An opening in the passivation layer uncovers a first region of an electrical contact. An electrical connection pad is formed to fill the opening by covering the first region and extend in projection in such a way as to cover a second region situated on the passivation layer surrounding the opening. The periphery of at least one of the first and second regions has an elongate or oblong shape. Centers of the opening and the pad are aligned with each other.

主权项

1. An electronic device, comprising:
an integrated circuit chip having an insulating passivation later and including an opening uncovering a first region of an electrical contact; at least one electrical connection pad filling said opening by covering said first region and extending in projection in such a way as to cover a second region situated on said passivation layer and surrounding said opening; wherein a periphery of each of said first and second regions is elliptical and presents, according to an orthogonal axis, a large dimension and a small dimension, and wherein the orthogonal axis or a direction of the large dimension, respectively of the small dimension, of the periphery of one of the first and second regions is superimposed to the orthogonal axis or direction of the small dimension, respectively of the large dimension, of the periphery of the other one of the first and second regions.