| 发明名称 |
Circuit Assembly and Corresponding Methods |
| 摘要 |
A circuit assembly (1800) includes a first circuit substrate (1200) defining a first major face (1201) and a second circuit substrate (1500) defining a second major face (1502). A plurality of electrical components (1203,1204,1205) can be disposed on one or more of the first major face or the second major face. One or more substrate bridging members (1301,1302,1303,1304) are disposed between the first circuit substrate and the second circuit substrate. Each substrate bridging member can define a unitary structure having a first end bonded to the first major face and a second end bonded to the second major face to bridge the first circuit substrate and the second circuit substrate. |
| 申请公布号 |
US2015022986(A1) |
申请公布日期 |
2015.01.22 |
| 申请号 |
US201313946351 |
申请日期 |
2013.07.19 |
| 申请人 |
Motorola Mobility LLC |
发明人 |
Steuer Paul R.;Barabolak Mark A.;Cauwels Patrick J.;Sutherland Timothy J. |
| 分类号 |
H05K1/14;H05K5/00;H05K1/11;H05K1/02 |
主分类号 |
H05K1/14 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A circuit assembly, comprising:
a first circuit substrate defining a first major face; a second circuit substrate defining a second major face; a plurality of electrical components disposed on one or more of the first major face or the second major face; and one or more substrate bridging members; each substrate bridging member defining a unitary structure having a first end bonded to the first major face and a second end bonded to the second major face to bridge the first circuit substrate and the second circuit substrate. |
| 地址 |
Libertyville IL US |
