发明名称 |
DETACHABLE INTERFACE FOR HIGH POWERED ELECTRONIC MODULES |
摘要 |
A detachable high powered electronic module of a high powered electronic system capable of receiving high power is disclosed. In one embodiment, the detachable high powered electronic includes a sub-array of the high powered electronic module, a heat exchanger assembly, a power converter module, and a mechanical interface. The mechanical interface is configured to detachably couple the sub-array and the power converter module via the heat exchanger assembly. Further, the detachable sub-array assembly is configured to deliver power received from the power converter module to the sub-array and also to substantially simultaneously extract heat away from the detachable sub-array. [FIG. 3] |
申请公布号 |
WO2015009582(A1) |
申请公布日期 |
2015.01.22 |
申请号 |
WO2014US46453 |
申请日期 |
2014.07.14 |
申请人 |
BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC. |
发明人 |
SLIECH, KEVIN, W.;DRESSER, TIMOTHY, M.;MAJCHER, JARED, P. |
分类号 |
H05K7/20;F28F7/00 |
主分类号 |
H05K7/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|