发明名称 PRINTED CIRCUIT BOARD PRECURSOR AND METHOD OF MANUFACTURING THE SAME AND FLEXIBLE PRINTED CIRCUIT BOARD
摘要 A method of manufacturing a printed circuit board precursor includes the steps of providing a substrate. Then the surface of the substrate is catalyzed to form a catalytic layer by a catalyst. Subsequently, a conductive layer is formed and attached to the surface of the catalytic layer. Finally, a metal layer is electroplated on the conductive layer. A printed circuit board precursor includes a substrate having a surface. Specifically, the surface is catalytically treated to form a catalytic layer. The precursor also includes a conductive layer which is attached to and covers the catalytic layer and a metal layer which is disposed on the conductive layer.
申请公布号 US2015021069(A1) 申请公布日期 2015.01.22
申请号 US201314058504 申请日期 2013.10.21
申请人 ICHIA TECHNOLOGIES,INC. 发明人 CHIU CHIEN-HWA;Chao Chih-Min;Kuo Peir-Rong;Chiang Chia-Hua;Hsiao Chih-Cheng;Kuan Feng-Ping;Lee Ying-Wei;Lee Wei-Cheng
分类号 H05K3/46;C23C28/00;H05K1/09 主分类号 H05K3/46
代理机构 代理人
主权项 1. A method of manufacturing a printed circuit board precursor comprising: providing a substrate; catalyzing the surface of the substrate to form a catalytic layer by a catalyst; forming a conductive layer attaching to the surface of the catalytic layer; and electroplating a metal layer on the conductive layer.
地址 Taoyuan County TW