发明名称 |
PRINTED CIRCUIT BOARD PRECURSOR AND METHOD OF MANUFACTURING THE SAME AND FLEXIBLE PRINTED CIRCUIT BOARD |
摘要 |
A method of manufacturing a printed circuit board precursor includes the steps of providing a substrate. Then the surface of the substrate is catalyzed to form a catalytic layer by a catalyst. Subsequently, a conductive layer is formed and attached to the surface of the catalytic layer. Finally, a metal layer is electroplated on the conductive layer. A printed circuit board precursor includes a substrate having a surface. Specifically, the surface is catalytically treated to form a catalytic layer. The precursor also includes a conductive layer which is attached to and covers the catalytic layer and a metal layer which is disposed on the conductive layer. |
申请公布号 |
US2015021069(A1) |
申请公布日期 |
2015.01.22 |
申请号 |
US201314058504 |
申请日期 |
2013.10.21 |
申请人 |
ICHIA TECHNOLOGIES,INC. |
发明人 |
CHIU CHIEN-HWA;Chao Chih-Min;Kuo Peir-Rong;Chiang Chia-Hua;Hsiao Chih-Cheng;Kuan Feng-Ping;Lee Ying-Wei;Lee Wei-Cheng |
分类号 |
H05K3/46;C23C28/00;H05K1/09 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
1. A method of manufacturing a printed circuit board precursor comprising:
providing a substrate; catalyzing the surface of the substrate to form a catalytic layer by a catalyst; forming a conductive layer attaching to the surface of the catalytic layer; and electroplating a metal layer on the conductive layer. |
地址 |
Taoyuan County TW |